Item# Z94016
Ideal for general purpose electronic repair and assembly use. Silver formulation provides improved conductivity performance, lower melting point while continuing to meet requirements for lead free solder use.
Features: 1 lb. spool
Rosin flux core
Diameter: 1mm (0.04")
Melting point: 217ø C (423ø F)
96.5% tin, 3.0% silver, 0.5% copper