Chem-Wik Rosin is especially designed for today's heat sensitive electronic components.The lighter mass, pure copper braid construction allows for better thermal
conductivity, even at low temperatures. Chem-Wik Rosin responds as much as 50% faster than conventional desoldering braids.This design minimizes overheating and requires less "contact" pressure for greater operator control. All sizes are coated with a Type "R" organic flux system.
Chem-Wik Rosin desoldering braid safely
removes solder from:
Thru-hole Components
Surface Mount Device Pads
BGA Pads
Micro Circuits
Terminals
Lugs and Posts
Identification Script